Dow Automotive Systems (Horgen, Switzerland) made big news at JEC Europe 2014 with the introduction of VORAFORCE, its ultralow-viscosity, fast-cure epoxy for automotive molding. Since then, says Peter ...

Today’s fan-out wafer-level packaging (FOWLP) processes use organic substrates composed of epoxy mold compound (EMC) created using a thermal compression process. EMC wafers are a cost-effective way to ...

Solvay Composite Materials (Alpharetta, Ga., U.S.) announced on Feb. 24 that it has launched CYCOM EP2750, a new highly drapable epoxy prepreg designed specifically for the compression molding of high ...

A novel epoxy molding compound for electronic industry application was used to conduct thermal analysis characterization using differential scanning calorimetry (DSC) and thermogravimetric analyzer ...

The global supply of epoxy molding compound for backend applications has fallen short of demand by 20% with delivery lead times extended further, according to industry sources. Sumitomo Bakelite, now ...

Bringing mass reduction capabilities to mass production facilities, Dow Automotive can now offer 90-second cycle times for resin transfer molding (RTM) with Voraforce 5300 resin matrix, making ...