Socionext, the Solution SoC company, today announced the availability of 3DIC support in its portfolio of well-proven capabilities for the delivery of complete solutions for consumer, AI, and HPC data ...

The transition from 3D to 5D ascension is a transformative journey that invites you to transcend the limitations of the physical world and embrace a higher state of consciousness.

Semiconductor packaging technologies have evolved from initial 1D PCB levels to the cutting-edge 3D hybrid bonding packaging at the wafer level.

A technical paper titled “On hardware security and trust for chiplet-based 2.5D and 3D ICs: Challenges and Innovations” was published by researchers at STMicroelectronics Crolles (ST-CROLLES), ...